Microsoft started with a bang When it made MS_DOS for IBM, Ruled with Windows and was about to get irrelevant when Satya Came to the rescue.
Qualcomm has experience in the mobile market, known for their always-connected processors. They aim to bring this feature to laptops, enabling seamless internet connectivity on the go, similar to smartphones.
Samsung is already mass producing the latest 8-layer HBM3E and expects the 12-layer version to be in production by Q2 2024.
We'll delve into the 5 different types of chip packages commonly employed in the semiconductor industry.
Chip packaging serves as the cornerstone of semiconductor device reliability and performance, fulfilling multiple objectives ranging from physical protection and electrical connectivity to thermal management and mechanical support.
South Korea commits $150 million over 7 years for R&D in advanced semiconductor packaging, focusing on HBM memory chips.
Through this partnership, ChatGPT users will gain access to attributed summaries, quotes, and rich links to FT journalism, enhancing the depth and reliability of information provided in response to relevant queries.
In contrast, Apple has faced challenges in the Chinese market, with iPhone sales declining by an estimated 19% during the same period.
Attempting to export a machine used for processing silicon wafer microchips to a blacklisted Chinese company (Changdu GaStone Technology Company)
If you are a DFT engineer with expertise in GPU technologies and Engineering (architecture, IP, SoC, software) and are passionate about defining the future of graphics computing and AI, we have opportunities for you.